HEAT SPREADERS FEATURING COEFFICIENT OF THERMAL EXPANSION MATCHING AND HEAT DISSIPATION USING SAME

Heat spreaders may be tailored for coefficient of thermal expansion (CTE) matching with electronic components or other heat-producing components in thermal communication therewith. In some cases, the heat-producing component may be bonded to the heat spreader while realizing the CTE matching. Copper nanoparticles may be consolidated under mild conditions with a CTE modifier to define a heat spreader configured for contacting a heat source and a heat sink, in which at least a portion of the heat spreader comprises a copper composite comprising the CTE modifier. The copper composite may be present in a thermally conductive body or a coating thereon that defines the heat spreader. The copper composite may contact a heat-producing component for promoting effective heat transfer and robust bonding between the two, such as within a printed circuit board (PCB), followed by dissipation of the heat to a heat sink or other heat-receiving structure.