SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

A semiconductor package includes a buffer die, a first core die stack stacked on the buffer die, the first core die stack including at least one first intermediate core and a first gap filling portion covering an outer surface of the at least one first intermediate core, and a second core die stack...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ahn, Seokgeun, Jeon, Gwangjae, Ko, Yeongbeom, Oh, Juhyeon, Lee, Sanghoon
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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