SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

A semiconductor package includes a buffer die, a first core die stack stacked on the buffer die, the first core die stack including at least one first intermediate core and a first gap filling portion covering an outer surface of the at least one first intermediate core, and a second core die stack...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Ahn, Seokgeun, Jeon, Gwangjae, Ko, Yeongbeom, Oh, Juhyeon, Lee, Sanghoon
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A semiconductor package includes a buffer die, a first core die stack stacked on the buffer die, the first core die stack including at least one first intermediate core and a first gap filling portion covering an outer surface of the at least one first intermediate core, and a second core die stack stacked on the first core die stack, the second core die stack including at least one second intermediate core and a second gap filling portion covering an outer surface of the at least one second intermediate core. The first gap filling portion and the second gap filling portion are directly bonded to each other.