THERMAL CONDUCTIVITY IN INTEGRATED CIRCUITS

Disclosed is an integrated circuit with a metallization stack that has thermal tower assemblages formed from wires in two or more metal layers to assist in dissipating heat out of the metallization stack.

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Bibliographische Detailangaben
Hauptverfasser:	CHRISTENSEN, Daniel, SHAMANNA, Manjunath, JIANG, Lei, PANTUSO, Daniel, KOMEYLI, Kambiz, HICKS, Jeffrey
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	Disclosed is an integrated circuit with a metallization stack that has thermal tower assemblages formed from wires in two or more metal layers to assist in dissipating heat out of the metallization stack.