ENCLOSURE

An enclosure is shown, comprising at least a first substrate having an outer surface and a second substrate having an outer surface, wherein the first substrate and the second substrate are arranged next to each other in such a way, that an inner surface of the first substrate is adjacent to an inne...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Rokka, Petri, Thomas, Jens Ulrich, Määttänen, Antti
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	An enclosure is shown, comprising at least a first substrate having an outer surface and a second substrate having an outer surface, wherein the first substrate and the second substrate are arranged next to each other in such a way, that an inner surface of the first substrate is adjacent to an inner surface of the second substrate, wherein the second substrate is transparent at least in part and/or at least for a bandwidth of wavelengths, at least one laser weld zone containing an information pattern in the enclosure, wherein the at least one laser weld zone extends from within the first substrate to within the second substrate and permanently joins the first substrate to the second substrate.