ENCAPSULATION FILM

An encapsulation film, a manufacturing method therefor, an organic electronic device comprising same, and a method for manufacturing an organic electronic device by using same, which provides an encapsulation film that has a structure capable of blocking moisture or oxygen flowing into an organic el...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KANG, Ho Sung, SEO, Beom Doo, RYU, Jae Seol, YOON, Jhin Yeong, RYU, Dong Hwan, KIM, Yern Seung, KIM, Kyung Inn, CHOI, Kwang Hui
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	An encapsulation film, a manufacturing method therefor, an organic electronic device comprising same, and a method for manufacturing an organic electronic device by using same, which provides an encapsulation film that has a structure capable of blocking moisture or oxygen flowing into an organic electronic device from the outside, and long-term reliability of the organic electronic device can be ensured. The encapsulation film includes an encapsulation layer that is a cured product of an encapsulation composition, wherein the encapsulation composition includes an encapsulation resin and a moisture adsorbent, and the encapsulation layer is a single layer and includes a first region, a second region, and a third region in which the concentrations of the moisture adsorbent are different according to the thickness direction.