CERAMIC COOLING BASE

Substrate supports and related components including additive manufacturing processes are disclosed. One substrate support assembly includes an electrostatic chuck; and a cooling base having a first surface that is bonded to a first surface of the electrostatic chuck with a metallic bonding material,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Garcia de Gorordo, Alvaro, Prouty, Stephen, Noujaim, Andrew Antoine, Schmid, Andreas
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:Substrate supports and related components including additive manufacturing processes are disclosed. One substrate support assembly includes an electrostatic chuck; and a cooling base having a first surface that is bonded to a first surface of the electrostatic chuck with a metallic bonding material, the cooling base comprising: a ceramic body having a coefficient of thermal expansion substantially the same as the electrostatic chuck; one or more cooling channels formed within the ceramic body; and one or more conductive zones extending through the ceramic body from the first surface to a second surface on an opposite side of the cooling base.