WATER-SOLUBLE FLUX AND SOLDER PASTE
This water-soluble flux capable of further suppressing the occurrence of voids contains a keto acid having a melting point of 40° C. or lower and a solvent having a boiling point of 240° C. or lower.
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| creator | YAMADA, Yo YAMAGAME, Tomohiro |
| description | This water-soluble flux capable of further suppressing the occurrence of voids contains a keto acid having a melting point of 40° C. or lower and a solvent having a boiling point of 240° C. or lower. |
| format | Patent |
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CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; FERROUS OR NON-FERROUS ALLOYS ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; TREATMENT OF ALLOYS OR NON-FERROUS METALS ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241212&DB=EPODOC&CC=US&NR=2024408705A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241212&DB=EPODOC&CC=US&NR=2024408705A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMADA, Yo</creatorcontrib><creatorcontrib>YAMAGAME, Tomohiro</creatorcontrib><title>WATER-SOLUBLE FLUX AND SOLDER PASTE</title><description>This water-soluble flux capable of further suppressing the occurrence of voids contains a keto acid having a melting point of 40° C. or lower and a solvent having a boiling point of 240° C. or lower.</description><subject>ALLOYS</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAOdwxxDdIN9vcJdfJxVXDzCY1QcPRzUQAKuLgGKQQ4Boe48jCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-NBgIwMjExMDC3MDU0dDY-JUAQDieSOc</recordid><startdate>20241212</startdate><enddate>20241212</enddate><creator>YAMADA, Yo</creator><creator>YAMAGAME, Tomohiro</creator><scope>EVB</scope></search><sort><creationdate>20241212</creationdate><title>WATER-SOLUBLE FLUX AND SOLDER PASTE</title><author>YAMADA, Yo ; 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| subjects | ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM |
| title | WATER-SOLUBLE FLUX AND SOLDER PASTE |
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