WATER-SOLUBLE FLUX AND SOLDER PASTE

This water-soluble flux capable of further suppressing the occurrence of voids contains a keto acid having a melting point of 40° C. or lower and a solvent having a boiling point of 240° C. or lower.

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Bibliographische Detailangaben
Hauptverfasser:	YAMADA, Yo, YAMAGAME, Tomohiro
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	This water-soluble flux capable of further suppressing the occurrence of voids contains a keto acid having a melting point of 40° C. or lower and a solvent having a boiling point of 240° C. or lower.