LOOP HEAT PIPE, HOUSING ASSEMBLY AND ELECTRONIC DEVICE

A loop heat pipe includes a housing component, a first capillary structure and a second capillary structure. The housing component is provided with a pipeline unit, a first partition part and at least two evaporation cavities. The evaporation cavity includes a vapor outlet communicated with one end of the pipeline unit and a liquid replenishment port communicated with the other end of a liquid replenishment passage. At least part of the first capillary structure is disposed in the liquid replenishment passage and the evaporation cavities. The second capillary structure is disposed in at least one of the replenishment passage and the evaporation cavities. The second capillary structure includes first bodies that correspond to the evaporation cavities on a one-to-one basis. The first bodies block the liquid replenishment ports of the corresponding evaporation cavities.