COVERS FOR INTEGRATED CIRCUIT PACKAGE SOCKETS

COVERS FOR INTEGRATED CIRCUIT PACKAGE SOCKETS

Covers for integrated circuit package sockets are disclosed herein. An example cover for a socket for an integrated circuit package includes a base including a cutout, the cutout to engage a pin associated with the socket, engagement of the cutout and the pin to maintain a position of the cover rela...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Van Horn, Allison, Buddrius, Eric W, Weldon, Kristin L, Sanford, Randall Scott, Frey, Emery Evon, Colorado Alonso, Francisco Javier, Gonzalez Lenero, Fernando, Pei, Min, Ramirez Macias, Ariatne, Cruz Ruiz, Israel
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:Covers for integrated circuit package sockets are disclosed herein. An example cover for a socket for an integrated circuit package includes a base including a cutout, the cutout to engage a pin associated with the socket, engagement of the cutout and the pin to maintain a position of the cover relative to the socket; and a handle to facilitate positioning of the cover to move the cutout into engagement with the pin.