SYSTEMS, APPARATUSES, AND METHODS FOR BACK-TO-BACK DIE FOR SEMICONDUCTOR PACKAGES

Systems, apparatuses, and methods for back-to-back (BTB) die for semiconductor packages are provided. For example, a semiconductor package may include a BTB die electrically coupled to a plurality of a Si blocks that may be positioned laterally from the BTB die. The semiconductor package may include...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	RIVIERE, Jean-Michel
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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