SYSTEMS, APPARATUSES, AND METHODS FOR BACK-TO-BACK DIE FOR SEMICONDUCTOR PACKAGES

Systems, apparatuses, and methods for back-to-back (BTB) die for semiconductor packages are provided. For example, a semiconductor package may include a BTB die electrically coupled to a plurality of a Si blocks that may be positioned laterally from the BTB die. The semiconductor package may include a heat sink that is also electrically coupled to a plurality of Si blocks that may be positioned laterally from the BTB die. The Si blocks may be electrically coupled to terminals on a side of the semiconductor package. The Si blocks may provide for improved protection, thermal managements, and shielding.