DIE PADDLE

A die paddle for a semiconductor assembly is disclosed. The die paddle includes first and second major faces, a coined region and at least one aperture. The first and second major faces are offset from another by a thickness of the die paddle and are at least partly defined by an outer perimeter of the die paddle. The coined region is recessed into at least one of the first and second major faces, the coined region extending from, and at least partway around, the outer perimeter of the die paddle. The at least one aperture, which extends through the coined region, is for receipt of material therein. The at least one aperture is disposed adjacent, and is at least partially surrounded by, an internal corner of the die paddle. The internal corner is at least partly defined by the coined region.