ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

An electronic device includes an electronic component including a chip and a protective layer disposed on the active surface of the chip; an encapsulation layer surrounding the electronic component; and a circuit structure contacting the first surface of the encapsulation layer and electrically conn...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAO, Ker-Yih, WANG, Ju-Li, CHENG, Wei-Yuan
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic device includes an electronic component including a chip and a protective layer disposed on the active surface of the chip; an encapsulation layer surrounding the electronic component; and a circuit structure contacting the first surface of the encapsulation layer and electrically connecting the electronic component. The protective layer has a second surface away from the active surface, and a first step difference between the first surface and the second surface is between 1 and 10 μm.