METHODS TO EXTEND NOC INTERCONNECT ACROSS MULTIPLE DICE IN 3D

Embodiments herein describe techniques to extend a network-on-chip (NoC) across multiple IC dice in 3D. An integrated circuit (IC) device includes first and second vertically-stacked IC dice, and an inter-die bus that interfaces between the second die and a NoC packet switch (NPS) of the first die....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SRINIVASAN, Krishnan, AHMAD, Sagheer, GAIDE, Brian C, ANSARI, Ahmad R, GUPTA, Aman
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS
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