METHODS TO EXTEND NOC INTERCONNECT ACROSS MULTIPLE DICE IN 3D

Embodiments herein describe techniques to extend a network-on-chip (NoC) across multiple IC dice in 3D. An integrated circuit (IC) device includes first and second vertically-stacked IC dice, and an inter-die bus that interfaces between the second die and a NoC packet switch (NPS) of the first die. The inter-die bus may include one or more driver circuits coupled to inter-die links of the inter-die bus. Communications over the inter-die links may be synchronous (e.g., packet-based) or asynchronous with the NPS (e.g., based on a point-to-point protocol, such as an AXI protocol). The inter-die bus may interface with a circuit block of the second IC device via a point-to-point (e.g., AXI) protocol or via a NPS of the second IC die. The IC device may include multiple inter-die buses, which may expand inter-die and intra-die routing options