PACKAGED ACOUSTIC WAVE DEVICES WITH MULTILAYER PIEZOELECTRIC SUBSTRATE HAVING QUARTZ SUBSTRATE

PACKAGED ACOUSTIC WAVE DEVICES WITH MULTILAYER PIEZOELECTRIC SUBSTRATE HAVING QUARTZ SUBSTRATE

A packaged multi-layer piezoelectric substrate surface acoustic wave device is disclosed. The packaged surface acoustic wave device can include a multi-layer piezoelectric substrate including a piezoelectric layer and a quartz substrate, an interdigital transducer electrode in electrical communicati...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Goto, Rei, Fukuhara, Hironori
Format: Patent
Sprache:eng
Schlagworte:
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
RESONATORS
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Beschreibung
Zusammenfassung:A packaged multi-layer piezoelectric substrate surface acoustic wave device is disclosed. The packaged surface acoustic wave device can include a multi-layer piezoelectric substrate including a piezoelectric layer and a quartz substrate, an interdigital transducer electrode in electrical communication with the piezoelectric layer, and a packaging structure having a coefficient of thermal expansion greater than 0 ppm/° C. and equal to or less than 35 ppm/° C. The packaging structure is coupled to the multi-layer piezoelectric substrate. The interdigital transducer electrode is positioned between the quartz substrate and the packaging structure.