FREQUENCY SELECTIVE SUBSTRATE ASSEMBLIES
A substrate assembly includes a first substrate and a second substrate each comprising an inner surface opposite an outer surface, a conductive material layer disposed on the inner surface of the second substrate, and an adhesive layer disposed between the inner surface of the first substrate and th...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A substrate assembly includes a first substrate and a second substrate each comprising an inner surface opposite an outer surface, a conductive material layer disposed on the inner surface of the second substrate, and an adhesive layer disposed between the inner surface of the first substrate and the inner surface of the second substrate such that the conductive material layer is positioned between the inner surface of the second substrate and the adhesive layer and the adhesive layer bonds the first substrate to the second substrate, wherein the substrate assembly comprises a reflection coefficient of 0.7 or less. |
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