PHOTOELECTRIC CONVERSION ELEMENT AND IMAGING DEVICE
[Object] To suppress crosstalk without reducing sensitivity.[Solution] A photoelectric conversion element includes: a first semiconductor layer of a first conductivity type containing a compound semiconductor material; a second semiconductor layer of a first conductivity type containing a compound s...
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creator | TAJIRI, Yusuke MINARI, Hideki SHIMIZU, Hiroshi |
description | [Object] To suppress crosstalk without reducing sensitivity.[Solution] A photoelectric conversion element includes: a first semiconductor layer of a first conductivity type containing a compound semiconductor material; a second semiconductor layer of a first conductivity type containing a compound semiconductor material having a larger band gap than the first semiconductor layer and stacked on a side of the first semiconductor layer opposite to the light incidence surface; a third semiconductor layer of a first conductivity type containing a compound semiconductor material having a larger band gap than the first semiconductor layer and stacked on the light incidence surface side of the first semiconductor layer; a first diffusion layer of a second conductivity type disposed to penetrate the second semiconductor layer from a side of the second semiconductor layer opposite to the light incidence surface and extend into the first semiconductor layer; a first electrode in contact with the first diffusion layer on the side of the second semiconductor layer opposite to the light incidence surface; a second diffusion layer of a second conductivity type disposed in a depth direction of the third semiconductor layer from a light incidence surface side of the third semiconductor layer; a second electrode in contact with the second diffusion layer on the light incidence surface side of the third semiconductor layer; and an insulating layer disposed between the second electrode and the third semiconductor layer. |
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a second semiconductor layer of a first conductivity type containing a compound semiconductor material having a larger band gap than the first semiconductor layer and stacked on a side of the first semiconductor layer opposite to the light incidence surface; a third semiconductor layer of a first conductivity type containing a compound semiconductor material having a larger band gap than the first semiconductor layer and stacked on the light incidence surface side of the first semiconductor layer; a first diffusion layer of a second conductivity type disposed to penetrate the second semiconductor layer from a side of the second semiconductor layer opposite to the light incidence surface and extend into the first semiconductor layer; a first electrode in contact with the first diffusion layer on the side of the second semiconductor layer opposite to the light incidence surface; a second diffusion layer of a second conductivity type disposed in a depth direction of the third semiconductor layer from a light incidence surface side of the third semiconductor layer; 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a second semiconductor layer of a first conductivity type containing a compound semiconductor material having a larger band gap than the first semiconductor layer and stacked on a side of the first semiconductor layer opposite to the light incidence surface; a third semiconductor layer of a first conductivity type containing a compound semiconductor material having a larger band gap than the first semiconductor layer and stacked on the light incidence surface side of the first semiconductor layer; a first diffusion layer of a second conductivity type disposed to penetrate the second semiconductor layer from a side of the second semiconductor layer opposite to the light incidence surface and extend into the first semiconductor layer; a first electrode in contact with the first diffusion layer on the side of the second semiconductor layer opposite to the light incidence surface; a second diffusion layer of a second conductivity type disposed in a depth direction of the third semiconductor layer from a light incidence surface side of the third semiconductor layer; a second electrode in contact with the second diffusion layer on the light incidence surface side of the third semiconductor layer; and an insulating layer disposed between the second electrode and the third semiconductor layer.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAO8PAP8Xf1cXUOCfJ0VnD29wtzDQr29PdTAIr5uvqFKDj6uSh4-jq6e_q5K7i4hnk6u_IwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvjQYCMDIxNjS1MLY2NHQ2PiVAEASjsoIA</recordid><startdate>20241128</startdate><enddate>20241128</enddate><creator>TAJIRI, Yusuke</creator><creator>MINARI, Hideki</creator><creator>SHIMIZU, Hiroshi</creator><scope>EVB</scope></search><sort><creationdate>20241128</creationdate><title>PHOTOELECTRIC CONVERSION ELEMENT AND IMAGING DEVICE</title><author>TAJIRI, Yusuke ; MINARI, Hideki ; SHIMIZU, Hiroshi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024395833A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>TAJIRI, Yusuke</creatorcontrib><creatorcontrib>MINARI, Hideki</creatorcontrib><creatorcontrib>SHIMIZU, Hiroshi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAJIRI, Yusuke</au><au>MINARI, Hideki</au><au>SHIMIZU, Hiroshi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHOTOELECTRIC CONVERSION ELEMENT AND IMAGING DEVICE</title><date>2024-11-28</date><risdate>2024</risdate><abstract>[Object] To suppress crosstalk without reducing sensitivity.[Solution] A photoelectric conversion element includes: a first semiconductor layer of a first conductivity type containing a compound semiconductor material; a second semiconductor layer of a first conductivity type containing a compound semiconductor material having a larger band gap than the first semiconductor layer and stacked on a side of the first semiconductor layer opposite to the light incidence surface; a third semiconductor layer of a first conductivity type containing a compound semiconductor material having a larger band gap than the first semiconductor layer and stacked on the light incidence surface side of the first semiconductor layer; a first diffusion layer of a second conductivity type disposed to penetrate the second semiconductor layer from a side of the second semiconductor layer opposite to the light incidence surface and extend into the first semiconductor layer; a first electrode in contact with the first diffusion layer on the side of the second semiconductor layer opposite to the light incidence surface; a second diffusion layer of a second conductivity type disposed in a depth direction of the third semiconductor layer from a light incidence surface side of the third semiconductor layer; a second electrode in contact with the second diffusion layer on the light incidence surface side of the third semiconductor layer; and an insulating layer disposed between the second electrode and the third semiconductor layer.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | PHOTOELECTRIC CONVERSION ELEMENT AND IMAGING DEVICE |
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