METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL HOT SPOT REGION OF AN IC STRUCTURE

METALLIC LID STRUCTURE FOR DISSIPATING HEAT GENERATED BY A THERMAL HOT SPOT REGION OF AN IC STRUCTURE

An Integrated Circuit (IC) structure includes a bottom level IC die and one or more top level IC dies. A first side of the one or more top level IC dies is bonded to the bottom IC die. A supporting substrate is coupled to a second side of the one or more top level IC dies. A plurality of conductive...

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Bibliographische Detailangaben
Hauptverfasser: Lin, Po-Yao, Yan, Kathy Wei, Liu, Shih-Wei, Wu, Tsunyen, Jiang, Sing-Da
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An Integrated Circuit (IC) structure includes a bottom level IC die and one or more top level IC dies. A first side of the one or more top level IC dies is bonded to the bottom IC die. A supporting substrate is coupled to a second side of the one or more top level IC dies. A plurality of conductive through-substrate vias (TSVs) each extend vertically through the supporting substrate. A metallic lid structure is disposed over the supporting substrate. The metallic lid structure is thermally coupled to the conductive TSVs.