SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE

A semiconductor device with improved reliability and a power conversion device including the semiconductor device are provided. A semiconductor device includes a semiconductor element, a first heat dissipation substrate, a second heat dissipation substrate, and a heat dissipation block. The semicond...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ARAI, Kiyoshi, SHIKANO, Taketoshi, HINO, Yasunari
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS BASIC ELECTRIC ELEMENTS CONTROL OR REGULATION THEREOF CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor device with improved reliability and a power conversion device including the semiconductor device are provided. A semiconductor device includes a semiconductor element, a first heat dissipation substrate, a second heat dissipation substrate, and a heat dissipation block. The semiconductor element has an electrode. The semiconductor element is mounted on the first heat dissipation substrate. The heat dissipation block is disposed to be opposed to the electrode. The second heat dissipation substrate is disposed on a side opposite to the electrode as viewed from the heat dissipation block. The bonding material covers a side surface of the heat dissipation block and is in contact with the electrode of the semiconductor element and the second heat dissipation substrate.