THERMAL MANAGEMENT MODULE OF AN INTEGRATED CIRCUIT ASSEMBLY

THERMAL MANAGEMENT MODULE OF AN INTEGRATED CIRCUIT ASSEMBLY

A thermal management module for an integrated circuit assembly includes a housing defining a configured to receive a fluid and having a variable cross-sectional area. The thermal management module also includes a wick disposed within the sealed passage, where the wick forms pores configured to conve...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Edara, Chetan Harsha, Tian, Jifang, Campbell, Scott J, Berberoglu, Halil, Tan, Cheng P, Buddaraju, Pavan Kumar Varma
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A thermal management module for an integrated circuit assembly includes a housing defining a configured to receive a fluid and having a variable cross-sectional area. The thermal management module also includes a wick disposed within the sealed passage, where the wick forms pores configured to convey a liquid form of the fluid toward an evaporator section of the thermal management module. The thermal management module also includes a void formed within the sealed passage between the wick and a wall of the housing, wherein the void is configured to convey a vapor form of the fluid toward a condenser section of the thermal management module.