PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PATTERNED BOTTOM SURFACE AND METHODS OF FORMING THE SAME

PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PATTERNED BOTTOM SURFACE AND METHODS OF FORMING THE SAME

A package structure includes a package substrate, a package module on the package substrate, a thermal interface material (TIM) layer on the package module, and a package lid on the TIM layer. The package lid includes a package lid foot portion attached to the package substrate, and a package lid pl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Liao, Sih-Hao, Lin, Yu-Wei, Hsiao, Meng-Hsuan, Yeh, Ming Shih
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A package structure includes a package substrate, a package module on the package substrate, a thermal interface material (TIM) layer on the package module, and a package lid on the TIM layer. The package lid includes a package lid foot portion attached to the package substrate, and a package lid plate portion on the package lid foot portion and including a patterned bottom surface having a plurality of recessed portions, wherein at least a portion of the TIM layer is located in the plurality of recessed portions.