PICKUP METHOD AND PICKUP APPARATUS

PICKUP METHOD AND PICKUP APPARATUS

A pickup method for picking up a chip affixed to a tape from the tape, the pickup method including a partial peeling step of forming a peeled region in which a part of the chip is peeled from the tape and an affixed region in which a part including a peripheral edge of the chip is affixed to the tap...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: MATSUOKA, Yuya
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A pickup method for picking up a chip affixed to a tape from the tape, the pickup method including a partial peeling step of forming a peeled region in which a part of the chip is peeled from the tape and an affixed region in which a part including a peripheral edge of the chip is affixed to the tape, by thrusting up the chip by a thrust-up member via the tape while sucking and holding the tape on an outside of the chip to be picked up, and a pickup step of next peeling a whole area of the chip from the tape and picking up the chip by holding the peeled region of the chip by a chip holder and lifting the chip in a direction in which the chip is separated from the tape.