SELECTIVE UNDERFILLING USING PRE-APPLIED THERMOSET ADHESIVE

SELECTIVE UNDERFILLING USING PRE-APPLIED THERMOSET ADHESIVE

Integrated circuit (IC) packages with pre-applied underfill in select areas, and methods of forming the same, are disclosed herein. In one example, an IC package includes a package substrate, a first IC die electrically coupled to the package substrate, a second IC die electrically coupled to the fi...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Brun, Xavier F, Xu, Dingying, Bai, Yiqun, Nam, Ye Seul, Serna, Roberto, Croissant, Jonas G, Gosselin, Timothy, Beltran, Gustavo Arturo, Orbase, Aris Mercado, Nieto Pescador, Jesus S
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Integrated circuit (IC) packages with pre-applied underfill in select areas, and methods of forming the same, are disclosed herein. In one example, an IC package includes a package substrate, a first IC die electrically coupled to the package substrate, a second IC die electrically coupled to the first IC die, and a thermoset adhesive that partially fills an area between the first IC die and the second IC die.