METHOD FOR FORMING SEMICONDUCTOR DEVICE
A method comprises generating an original layout having main pattern sets; simulating a first energy distribution of the original layout on a pupil plane of a lithography system, wherein the first energy distribution has a first wavefront; generating a first modified layout by inserting dummy patter...
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Sprache: | eng |
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Zusammenfassung: | A method comprises generating an original layout having main pattern sets; simulating a first energy distribution of the original layout on a pupil plane of a lithography system, wherein the first energy distribution has a first wavefront; generating a first modified layout by inserting dummy pattern sets in regions of the original layout that are not occupied by the main pattern sets; simulating a second energy distribution of the first modified layout on a pupil plane of a lithography system; determining whether a second wavefront of the simulated second energy distribution is more homogeneous than the first wavefront of the first energy distribution; and performing a first lithography process using a first photomask having the first modified layout in response to second wavefront of the simulated second energy distribution being determined as more homogeneous than the first wavefront of the first energy distribution. |
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