WET CONNECT METHODS AND APPARATUS USING CONFORMAL MULTILAYER SOFT SHELL MATRIX AND CONDUCTIVE MATERIAL
Embodiments disclosed herein relate to a conformal multilayer soft shell apparatus and a system to make a downhole connection between an electric power supply, a conformal multilayer soft shell apparatus, and a downhole system requiring power. The conformal multilayer soft shell apparatus may includ...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | Embodiments disclosed herein relate to a conformal multilayer soft shell apparatus and a system to make a downhole connection between an electric power supply, a conformal multilayer soft shell apparatus, and a downhole system requiring power. The conformal multilayer soft shell apparatus may include an innermost layer with one or more electrically conductive materials, a number of middle layers, and a protective outermost layer. |
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