BUFFER STRUCTURE AND PREPARATION METHOD FOR SAME, AND DISPLAY APPARATUS

A buffer structure, a preparation method for the buffer structure, and a display apparatus are provided. The buffer structure includes a substrate layer. A plurality of microporous structures are distributed in the substrate layer. The substrate layer is doped with electrically and thermally conduct...

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Bibliographische Detailangaben
1. Verfasser:	ZUO, Kailong
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A buffer structure, a preparation method for the buffer structure, and a display apparatus are provided. The buffer structure includes a substrate layer. A plurality of microporous structures are distributed in the substrate layer. The substrate layer is doped with electrically and thermally conductive materials. The electrically and thermally conductive material is distributed in the whole-layer structure of the substrate layer. The electrically and thermally conductive materials forms a heat conducting network structure in the substrate layer.