ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

An electronic device including: a bump that includes a tapered protrusion and a tapered conductive film, the tapered protrusion including a base material of a substrate and of which an area of a cross section that intersects with a normal direction of the substrate is gradually reduced toward a fron...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIMANOUCHI, Takeaki, TAKENOUCHI, Masatoshi, KOUMA, Norinao, TAKAHASHI, Tsuyoshi
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS
COMPUTING
COUNTING
ELECTRICITY
PHYSICS
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Beschreibung
Zusammenfassung:An electronic device including: a bump that includes a tapered protrusion and a tapered conductive film, the tapered protrusion including a base material of a substrate and of which an area of a cross section that intersects with a normal direction of the substrate is gradually reduced toward a front end, the tapered conductive film being a part of the bump that covers a surface of the protrusion and reflects a shape of the protrusion.