SELECTIVE INSULATION OF MOUNT POINTS

SELECTIVE INSULATION OF MOUNT POINTS

An electronic device is provided that includes a heatsink, an electrical circuit mounted on the heatsink, and a chassis. A plurality of heat-insulating connectors mounting the heatsink to the chassis at a first plurality of mount points, and a plurality of heat-conducting connectors mounting the hea...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SAUERS, Jason C, RESNICK, Samuel A, MOROIANU, Dragos, SELVAKUMAR, Sivesh, HOBSON, Phil M, CAMPO, Laura M
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:An electronic device is provided that includes a heatsink, an electrical circuit mounted on the heatsink, and a chassis. A plurality of heat-insulating connectors mounting the heatsink to the chassis at a first plurality of mount points, and a plurality of heat-conducting connectors mounting the heatsink to the chassis at a second plurality of mount points. The first plurality of mount points are located closer to the electrical circuit mounted on the heatsink than the second plurality of mount points.