HEAT DISSIPATION SYSTEM, POWER SUPPLY SYSTEM, AND CHARGING PILE

A heat dissipation system includes a heat dissipation cavity, a first liquid cooling assembly, an air cooling assembly, a first power cavity, and a first power device. The first liquid cooling assembly and the first power cavity are disposed inside the heat dissipation cavity. The first power device...

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Bibliographische Detailangaben
Hauptverfasser:	WEI, Longhe, LIAN, Zhisheng
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A heat dissipation system includes a heat dissipation cavity, a first liquid cooling assembly, an air cooling assembly, a first power cavity, and a first power device. The first liquid cooling assembly and the first power cavity are disposed inside the heat dissipation cavity. The first power device is disposed inside the first power cavity. The first power cavity is in contact with the first liquid cooling assembly. An air inlet and an air outlet of the air cooling assembly are disposed on the heat dissipation cavity. An air-cooled channel connected between the air inlet and the air outlet passes through the first liquid cooling assembly and/or the first power cavity. The first liquid cooling assembly and the air cooling assembly are configured to dissipate heat for the first power device.