WIRING BOARD

In a wiring board, a first substrate, a surface electrical conductor layer, and a second substrate are laminated in this order. The second substrate contains an organic material as an insulating base material. The surface electrical conductor layer is located on a surface of the first substrate, and...

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Bibliographische Detailangaben
Hauptverfasser:	OKAMOTO, Kazuhiro, MATSUMOTO, Yuhei, YAMAMOTO, Sentarou
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	In a wiring board, a first substrate, a surface electrical conductor layer, and a second substrate are laminated in this order. The second substrate contains an organic material as an insulating base material. The surface electrical conductor layer is located on a surface of the first substrate, and the second substrate includes a plurality of interlayer connection conductors. The insulating base material of the second substrate includes a first region and a second region. The first region is located on the surface electrical conductor layer. The second region is located on the surface of the first substrate. The first region has a lower ratio of voids and pores than the second region.