SEMICONDUCTOR PACKAGE

A semiconductor package may include a redistribution substrate, a first lower semiconductor chip on the redistribution substrate, an upper semiconductor chip on the first lower semiconductor chip, and a first insulating element between the redistribution substrate and the upper semiconductor chip to enclose the first lower semiconductor chip. The first lower semiconductor chip may include a first pad on a first surface of the first lower semiconductor chip, a first protection layer enclosing the first pad, a first penetration via that penetrates the first lower semiconductor chip and is electrically connected to the first pad, a second pad on a second surface of the first lower semiconductor chip facing the upper semiconductor chip, and a first insulating layer including the second pad. A particle size of a material including the first protection layer may be smaller than that of the first insulating element.