CAPACITIVE COUPLING PACKAGE STRUCTURE

CAPACITIVE COUPLING PACKAGE STRUCTURE

A capacitive coupling package structure includes a plurality of first leads, a plurality of second leads, two first coupling plates, two second coupling plates, a first chip, a second chip, a first package member, and a second package member. The two first coupling plates and the two second coupling...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAO, TING-WEI, WANG, YOU-FA, WU, YUAN-LUNG, LEE, CHIA-YUN, LIN, PU-HAN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A capacitive coupling package structure includes a plurality of first leads, a plurality of second leads, two first coupling plates, two second coupling plates, a first chip, a second chip, a first package member, and a second package member. The two first coupling plates and the two second coupling plates are vertically separate from each other and are partially and vertically overlapped with each other, respectively.