METHOD OF FORMING PATTERNS

Provided is a method of forming patterns which includes coating a metal- containing resist composition on a substrate to form a resist layer; coating a composition for removing edge beads along edges of the substrate; performing drying and heat-treatment; and exposing and developing to form a resist...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KWAK, Taeksoo, PARK, Gyeonghun, SONG, Myoungsoo, PARK, Si-Kyun, BEOM, Taewon, LEE, Donghyung, MOON, Hyungrang, SONG, Donghoon
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	Provided is a method of forming patterns which includes coating a metal- containing resist composition on a substrate to form a resist layer; coating a composition for removing edge beads along edges of the substrate; performing drying and heat-treatment; and exposing and developing to form a resist pattern, wherein after the composition for removing edge beads is coated, a maximum hump height of the resist layer is less than or equal to about 300 nm in an area of about 1 mm to about 30 mm from the edges of the substrate toward a center of the substrate.