CURABLE SILICONE COMPOSITION, CURED OBJECT THEREFROM, AND METHOD FOR PRODUCING SAID CURED OBJECT

Provided is a curable silicone composition or the like having excellent handleability and curing properties during sealing due to good hot-melt properties and excellent melting properties, in addition to having excellent cured product mechanical strength and substrate bonding strength, making the co...

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Bibliographische Detailangaben
Hauptverfasser:	HAYASHI, Masayuki, MATSUSHIMA, Hidenori, OZAKI, Koichi, YAMAZAKI, Ryosuke, IMAIZUMI, Toru
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	Provided is a curable silicone composition or the like having excellent handleability and curing properties during sealing due to good hot-melt properties and excellent melting properties, in addition to having excellent cured product mechanical strength and substrate bonding strength, making the composition suitable as a sealant for semiconductor devices. The curable silicone composition comprises: (A) a hot-melt MDT-type organopolysiloxane resin having a specific siloxane unit ratio; (B) an organohydrogensiloxane compound; (C) a hydrosilylation catalyst; and (D) a functional inorganic filler in an amount of 400 to 3,000 parts by mass per 100 parts by mass of the total of components (A) to (C). The curable silicone composition is solid at 25° C. and has hot-melt properties at a temperature of 200° C. or lower.