METHOD OF FORMING A SEMICONDUCTOR DEVICE PACKAGE WITH WARPAGE CONTROL

A method of forming a semiconductor device package is provided, including bonding passive devices to a first surface of a package substrate; forming a first underfill element on the first surface to surround the passive devices; forming a first molding layer to encapsulate the passive devices and the first underfill element; bonding a die to a second surface of the package substrate; forming a second underfill element on the second surface to surround the die; forming a second molding layer to encapsulate the die and the second underfill element; forming openings in the second molding layer to expose contact pads formed on the second surface of the package substrate; and disposing conductive bumps in the openings to electrically contact the contact pads, wherein the conductive bumps is in direct contact with the second surface and exposed from the second molding layer.