SEMICONDUCTOR DEVICE

A semiconductor device is configured to suppress an occurrence of dielectric breakdown in the semiconductor device. The semiconductor device includes an insulating element, a conductive member on which the insulating element is mounted, and a sealing resin covering the insulating element. The conduc...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NISHIOKA, Taro, OSUMI, Yoshizo
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A semiconductor device is configured to suppress an occurrence of dielectric breakdown in the semiconductor device. The semiconductor device includes an insulating element, a conductive member on which the insulating element is mounted, and a sealing resin covering the insulating element. The conductive member includes an uneven part covered by the sealing resin. As an example, in the semiconductor device, the conductive member includes a first die pad on which the insulating element is mounted, and the uneven part includes a first region that is provided on the first die pad.