SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPROVED PACKAGE RELIABILITY

SEMICONDUCTOR PACKAGE WITH UNDER-BUMP METALLIZATION PROVIDING IMPROVED PACKAGE RELIABILITY

A method of manufacturing a semiconductor package includes forming an under-bump metallization, and forming a redistribution layer. The redistribution layer includes a plurality of metallization layers embedded in intermetal dielectric material. The metallization layers of the redistribution layer e...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Chuang, Yao-Chun, Yang, Tien-Chung, Kuo, Ting-Ting, Huang, Li-Hsien, Lu, Yinlung
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method of manufacturing a semiconductor package includes forming an under-bump metallization, and forming a redistribution layer. The redistribution layer includes a plurality of metallization layers embedded in intermetal dielectric material. The metallization layers of the redistribution layer electrically connect a semiconductor die with the under-bump metallization. The under-bump metallization includes a bonding pad and a guard ring encircling the bonding pad. The guard ring forms an annular pocket encircling the bonding pad. The annular pocket is filled with a polymer material. A crack formed in underfill material coating a bonding bump bonded to the bonding pad is blocked from penetrating into the redistribution layer using the guard ring.