ISOLATION MODULE FORMATION FOR BACKSIDE POWER DELIVERY APPLICATION

ISOLATION MODULE FORMATION FOR BACKSIDE POWER DELIVERY APPLICATION

Semiconductor devices and methods of manufacturing the same are described. The method includes combining selective recess of a sacrificial layer and isotropic etching of a silicon layer in order to form a protective cap that will allow the silicon layer of the substrate to be etched without affectin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Basker, Veeraraghavan S, Lee, Byeong Chan, Kim, Kyoung Ha
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Semiconductor devices and methods of manufacturing the same are described. The method includes combining selective recess of a sacrificial layer and isotropic etching of a silicon layer in order to form a protective cap that will allow the silicon layer of the substrate to be etched without affecting the sacrificial layer.