SEMICONDUCTOR APPARATUS USING BOTH SURFACES OF A WAFER AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR APPARATUS USING BOTH SURFACES OF A WAFER AND MANUFACTURING METHOD OF THE SAME

A semiconductor apparatus includes a semiconductor layer having a first surface and a second surface that is opposite to the first surface; a first wire structure on the first surface of the semiconductor layer; a second wire structure on the second surface of the semiconductor layer; a through via...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Oh, Gyesik, Jun, Joonho, Lee, Minwoo, Jo, Byoungkon, Im, Wangyong, Kim, Duk Sung
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor apparatus includes a semiconductor layer having a first surface and a second surface that is opposite to the first surface; a first wire structure on the first surface of the semiconductor layer; a second wire structure on the second surface of the semiconductor layer; a through via that extends through the semiconductor layer and is electrically connected to the first wire structure and the second wire structure; a first semiconductor element layer that is adjacent to the first surface of the semiconductor layer and in the semiconductor layer; and a second semiconductor element layer that is adjacent to the second surface of the semiconductor layer and in the semiconductor layer.