BACKSIDE SELF ALIGNED SKIP VIA
A semiconductor structure including a gate contact above and in direct contact with a top surface of a gate. a backside wiring layer below a backside power delivery network. and a contact via extending between the gate contact and the backside wiring layer.
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Hauptverfasser: | , , , , , , , , |
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A semiconductor structure including a gate contact above and in direct contact with a top surface of a gate. a backside wiring layer below a backside power delivery network. and a contact via extending between the gate contact and the backside wiring layer. |
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