METHOD OF IMPROVING PACKAGE CREEPAGE DISTANCE

The present disclosure relates to a method of improving semiconductor package creepage, the package includes a semiconductor device, and a plurality of electrically conductive contacts at a surface of the package, the package includes insulating material for electrically insulating the package betwe...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Funke, Hans-Juergen, Böttcher, Tim, Shiu, Heiming
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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