METHOD OF IMPROVING PACKAGE CREEPAGE DISTANCE

The present disclosure relates to a method of improving semiconductor package creepage, the package includes a semiconductor device, and a plurality of electrically conductive contacts at a surface of the package, the package includes insulating material for electrically insulating the package between the plurality of electrically conductive contacts, an initial creepage distance is defined by the shortest distance over the surface of the package between two of the plurality of contacts, and the method includes the steps of applying a coating over at least part of the insulating material of the package, and the coating has an electrical volume resistivity higher than an electrical volume resistivity of the insulating material of the package to increase the initial creepage distance and improve package creepage of the semiconductor package.