Multi-chip transceiver array devices

An optoelectronic device (20, 90, 120) includes a photonic integrated circuit (PIC) (24, 92, 94, 126), which includes a PIC substrate (34), having a first side mounted on a carrier substrate (26, 96), first electrical connection pads (70, 130) on a second side of the PIC substrate, optical waveguide...

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Bibliographische Detailangaben
Hauptverfasser:	Hajati, Arman, Gerson, Yuval, Shpunt, Alexander
Format:	Patent
Sprache:	eng
Schlagworte:	ANALOGOUS ARRANGEMENTS USING OTHER WAVES BASIC ELECTRIC ELEMENTS DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES MEASURING OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS RADIO DIRECTION-FINDING RADIO NAVIGATION SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	An optoelectronic device (20, 90, 120) includes a photonic integrated circuit (PIC) (24, 92, 94, 126), which includes a PIC substrate (34), having a first side mounted on a carrier substrate (26, 96), first electrical connection pads (70, 130) on a second side of the PIC substrate, optical waveguides (52) on the PIC substrate, and electrical conductors (68, 134) disposed on the PIC substrate and connecting to one or more of the first electrical connection pads. At least one electronic integrated circuit (22, 100, 122, 124) includes a semiconductor substrate (74) having a third side mounted on the second side of the PIC substrate and second electrical connection pads (72, 128) on the semiconductor substrate in electrical communication with the first electrical connection pads. One or more electronic circuit components (76, 78, 80, 82) on the semiconductor substrate are connected electrically to the second electrical connection pads.