PACKAGING DESIGN FOR A FLOW SENSOR AND METHODS OF MANUFACTURING THEREOF

A sensor assembly includes a substrate including an outer region, an inner region, and a middle region positioned between the outer region and the inner region, the substrate further including electrical contact pads on at least the inner region. The sensor assembly further includes a housing couple...

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Bibliographische Detailangaben
Hauptverfasser: Parkhe, Vijay, Xu, Ming, Krishnamurthy, Srikanth, Okada, Ashley M, Gunturi, Ramachandra Murthy
Format: Patent
Sprache:eng
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Zusammenfassung:A sensor assembly includes a substrate including an outer region, an inner region, and a middle region positioned between the outer region and the inner region, the substrate further including electrical contact pads on at least the inner region. The sensor assembly further includes a housing coupled to the substrate at the outer region to provide a hermetic seal. The sensor assembly further includes a sensor device coupled to the substrate, via the electrical contact pads, at the inner region.