CURABLE RESIN COMPOSITION, CURED PRODUCT, ELECTRONIC COMPONENT, OPTICAL COMPONENT, AND COMPOSITE MEMBER

A curable resin composition according to the present invention makes it possible to form a cured product having heat resistance suited for use in applications such as electronic components including printed circuit boards, semiconductor elements and light emitting diodes (LEDs), and automotive elect...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ENOKI, Nobuo, YANO, Masakazu, FUJIMORI, Sayaka, HIROTA, Takayuki, SUWA, Kazuya
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PHYSICS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	A curable resin composition according to the present invention makes it possible to form a cured product having heat resistance suited for use in applications such as electronic components including printed circuit boards, semiconductor elements and light emitting diodes (LEDs), and automotive electronic components, the curable resin composition containing: a silicon compound (A) that is formed from either one or both of the silsesquioxane groups represented by formula (1) or (2) and from at least one structural unit among the siloxane groups represented by formulas (3)-(5), and that has a weight average molecular weight of 3,000-1,000,000; and a compound (B) that contains at least one element among Ce, La, Pr, Nd, Y and Fe.(a represents the structure indicated herein; R1-R7 represent prescribed groups)