HYBRID DIAMOND BASED HEAT SPREADERS

A semiconductor unit that includes a hot areas generating portion that generates hot areas during operation; and hybrid diamond heat spreaders (HDHSs) that are configured to dissipate at least part of the heat generated in the hot areas. A HDHS includes a diamond layer of a first thickness, a first mechanical strength, a first thermal conductivity, and a first coefficient of thermal expansion (CTE) and a diamond layer support element of a second thickness, a second mechanical strength, and a second CTE. According to one or more embodiments at least one of the following is true: (a) the first thickness is lower than the second thickness, (b) the first mechanical strength is higher than the second mechanical strength, (c) the first thermal conductivity exceeds the second thermal conductivity and (d) the second CTE exceeds the first CTE.