Semiconductor Fin Structures

A device includes a semiconductor substrate, and a plurality of semiconductor fins parallel to each other, wherein the plurality of semiconductor fins is a portion of the semiconductor substrate. A Shallow Trench Isolation (STI) region is on a side of the plurality of semiconductor fins. The STI reg...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Lin, Chia Tai, Lin, Yih-Ann, Chen, Chao-Cheng, Chen, Ryan Chia-Jen
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A device includes a semiconductor substrate, and a plurality of semiconductor fins parallel to each other, wherein the plurality of semiconductor fins is a portion of the semiconductor substrate. A Shallow Trench Isolation (STI) region is on a side of the plurality of semiconductor fins. The STI region has a top surface and a non-flat bottom surface, wherein the plurality of semiconductor fins is over the top surface of the STI region.